DS1211S+
| Parameters | |
|---|---|
| Surface Mount | YES |
| Packaging | Tube |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 20 |
| Terminal Finish | MATTE TIN |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 5V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 20 |
| JESD-30 Code | R-PDSO-G20 |
| Qualification Status | COMMERCIAL |
| Operating Temperature (Max) | 70°C |
| Temperature Grade | COMMERCIAL |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Height Seated (Max) | 2.65mm |
| Length | 12.8mm |
| Width | 7.5mm |
| RoHS Status | ROHS3 Compliant |
DS1211S+ Overview
A package of materials from Tube is included with the product. 20 terminations prevent signals from reflecting off the transmission line's end. This device is supplied with voltage 5V. Pins 20 are configured on this board. Reflow temperature limit 260 is determined by the component whose tolerance for high temperatures is the lowest. A unit of MICROPROCESSOR CIRCUIT is used as its uPs/uCs/peripheral ICs.
DS1211S+ Features
DS1211S+ Applications
There are a lot of Rochester Electronics, LLC DS1211S+ Memory Controllers applications.
- Multi-Chip-Packages (MCP)
- Solid State Disks (SSD)
- Embedded Systems
- System-in-Package (SiP) embedded flash drives (eSSD)
- Ultra durable Flash Drive
- Security Flash Drive
- eUSB, embedded USB module
- Embedded Flash
- Multi-Chip-Modules (MCM)
- IDE Disk-on-Modules (DoM)
