Parameters |
Mounting Type |
Surface Mount |
Package / Case |
16-SOIC (0.295, 7.50mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tube |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
16 |
Terminal Finish |
MATTE TIN |
Technology |
CMOS |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
5V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Function |
Elastic Store |
Qualification Status |
COMMERCIAL |
Interface |
PCM |
Number of Circuits |
1 |
Current - Supply |
9mA |
Telecom IC Type |
ELASTIC BUFFER |
Height Seated (Max) |
2.65mm |
Width |
7.5mm |
RoHS Status |
ROHS3 Compliant |
DS2175SN+ Overview
Space is saved on the board by using the 16-SOIC (0.295, 7.50mm Width) package.Telecommunications equipment is packed according to Tube's method.The mounting type is Surface Mount.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 4.5V~5.5V is provided.Operating temperatures of -40°C~85°C can ensure reliable performance.16 terminations can be found in the configuration.There is a voltage supply called 5V that it uses.Telecom ICs of type ELASTIC BUFFER are used in it.There is a supply current of 9mA for telecom equipment to operate on.
DS2175SN+ Features
Available in the 16-SOIC (0.295, 7.50mm Width) package
ELASTIC BUFFER as telecom IC type
DS2175SN+ Applications
There are a lot of Rochester Electronics, LLC DS2175SN+ Telecom applications.
- Dual battery supply voltage SLICs
- PBX (Private Branch Exchange)
- Digital Access Cross-connect System (DACs)
- Fault Tolerant Systems
- Integrated Access Devices
- T1 Rates PCM Line Interface
- SONET/SDH terminal
- Home Gateway
- ISDN NT1/TA
- Remote wireless modules