Parameters |
Mounting Type |
Through Hole |
Package / Case |
24-DIP (0.300, 7.62mm) |
Surface Mount |
NO |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
24 |
Terminal Finish |
TIN LEAD |
Technology |
CMOS |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
240 |
Supply Voltage |
5V |
Terminal Pitch |
2.54mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
20 |
JESD-30 Code |
R-PDIP-T24 |
Function |
Receive Buffer |
Qualification Status |
COMMERCIAL |
Interface |
TDM |
Number of Circuits |
1 |
Current - Supply |
5mA |
Telecom IC Type |
ELASTIC BUFFER |
Height Seated (Max) |
4.572mm |
Length |
30.545mm |
Width |
7.62mm |
RoHS Status |
Non-RoHS Compliant |
DS2176 Overview
To save board space, the 24-DIP (0.300, 7.62mm) package is used.Telecommunications equipment is packed using the Tube method.A Through Hole mounting type is used.A 1-circuit composes this telecom IC .At 0°C~70°C, reliable performance can be achieved.24 terminations can be found in the configuration.With 5V as the supply voltage, it operates.ELASTIC BUFFER is the type of IC it uses for telecom.5mA is the supply current.
DS2176 Features
Available in the 24-DIP (0.300, 7.62mm) package
ELASTIC BUFFER as telecom IC type
DS2176 Applications
There are a lot of Rochester Electronics, LLC DS2176 Telecom applications.
- Home Side Box
- Digital Access Cross-connect System (DACs)
- Channel Banks
- Residential Gateways
- E1 LAN/WAN Routers
- Multiplexers
- T1/E1/J1 Performance Monitoring
- Fiber to the Home (FTTH)
- Wireless base stations
- E1 Network Equipment