Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 300-BBGA |
Surface Mount | YES |
Operating Temperature | -40°C~85°C |
Packaging | Tube |
Published | 2002 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 300 |
Terminal Finish | Matte Tin (Sn) |
HTS Code | 8542.39.00.01 |
Subcategory | Other Telecom ICs |
Technology | CMOS |
Voltage - Supply | 2.97V~3.63V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | DS21FF42 |
Pin Count | 300 |
JESD-30 Code | S-PBGA-B300 |
Qualification Status | Not Qualified |
Power Supplies | 3.3V |
Interface | Parallel/Serial |
Current - Supply | 300mA |
Telecom IC Type | FRAMER |
Height Seated (Max) | 2.54mm |
Length | 27mm |
Width | 27mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |