DS21FT44N+
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 300-BBGA |
| Supplier Device Package | 300-PBGA (27x27) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 2.97V~3.63V |
| Interface | Parallel/Serial |
| Current - Supply | 225mA |
| RoHS Status | ROHS3 Compliant |
DS21FT44N+ Overview
The 300-BBGA package reduces the amount of space on a board.For packing, Tray is used.A Surface Mount mounting type is used.2.97V~3.63V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A -40°C~85°C-temperature setting offers reliable performance.Wit h a supply current of 225mA, telecom equipment operates.
DS21FT44N+ Features
Available in the 300-BBGA package
DS21FT44N+ Applications
There are a lot of Rochester Electronics, LLC DS21FT44N+ Telecom applications.
- Dual battery supply voltage SLICs
- Fiber
- Digital Cross Connect Systems
- Private branch exchange (PBX)
- High speed data transmission line cards
- Cable PC
- Microwave transmission systems
- Digital Cross-connect Systems (DCS)
- ISDN terminal adapter
- E1 Network Equipment
