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DS21FT44N

Telecom device


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-DS21FT44N
  • Package: 300-BBGA
  • Datasheet: PDF
  • Stock: 123
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 300-BBGA
Supplier Device Package 300-PBGA (27x27)
Operating Temperature -45°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 2.97V~3.63V
Interface Parallel/Serial
Current - Supply 225mA
RoHS Status Non-RoHS Compliant

DS21FT44N Overview


The 300-BBGA package reduces the amount of space on a board.Telecommunications equipment is packed according to Tray's method.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is possible to increase efficiency by providing 2.97V~3.63V with a higher voltage.A -45°C~85°C-temperature setting offers reliable performance.Telecom equipment operates wit h a supply current of 225mA.

DS21FT44N Features


Available in the 300-BBGA package

DS21FT44N Applications


There are a lot of Rochester Electronics, LLC DS21FT44N Telecom applications.

  • Switching Systems
  • E1 Multiplexer
  • Home Side Box
  • Fiber In The Loop (FITL)
  • Integrated Access Devices (IADs)
  • Cross Connects
  • Microwave transmission systems
  • PCM channel bank
  • E1 LAN/WAN Routers
  • Wireless local loop (WLL)

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