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DS21Q50LN

100 TerminationsDS21Q50 Telecom device4 Circuits


  • Manufacturer: Maxim Integrated
  • Nocochips NO: 503-DS21Q50LN
  • Package: 100-LQFP
  • Datasheet: PDF
  • Stock: 757
  • Description: 100 TerminationsDS21Q50 Telecom device4 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
Published 2004
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Other Telecom ICs
Technology CMOS
Voltage - Supply 3.14V~3.47V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number DS21Q50
JESD-30 Code S-PQFP-G100
Function Transceiver
Qualification Status Not Qualified
Power Supplies 3.3V
Interface E1
Number of Circuits 4
Current - Supply 230mA
Carrier Type CEPT PCM-30/E-1
Height Seated (Max) 1.6mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

DS21Q50LN Overview


100-LQFP package is used to save board space.For telecommunications equipment packing, the Tray method is used.The mounting type is Surface Mount.A 4-circuit composes this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.14V~3.47V can be operated more efficiently.-40°C~85°C is the operating temperature that can be set for reliable performance.There are 100 terminations can be found in telecom switching configuration.It operates with a voltage of 3.3V.Telecom switching's base part number, DS21Q50, can be used to find related parts.The current supply is 230mA.Other Telecom ICs is a subcategory of telecommunications device .

DS21Q50LN Features


Available in the 100-LQFP package

DS21Q50LN Applications


There are a lot of Maxim Integrated DS21Q50LN Telecom applications.

  • Multi-Line E1 Interface Cards
  • DECT (Digital European Cordless Telephone) Base Stations
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Digital Modems
  • Add/Drop multiplexers (ADMs)
  • Routers
  • Integrated Access Devices
  • SONET/SDH terminal
  • CSU/DSU E1/T1/J1 Interface

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