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DS21Q554BN+

Telecom device4 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-DS21Q554BN+
  • Package: 256-BGA
  • Datasheet: -
  • Stock: 375
  • Description: Telecom device4 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-BGA (27x27)
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 5V
Function Transceiver
Interface E1
Number of Circuits 4
RoHS Status Non-RoHS Compliant

DS21Q554BN+ Overview


Board space can be saved by using the 256-BGA package.For packing, Tray is used.Surface Mount is used as telecommunications equipment mounting type.A 4 circuit is the heart of this telecom IC .A higher supply voltage for 5V will improve efficiency.

DS21Q554BN+ Features


Available in the 256-BGA package

DS21Q554BN+ Applications


There are a lot of Rochester Electronics, LLC DS21Q554BN+ Telecom applications.

  • Fiber in the loop (FITL)
  • T3 channelized access concentrators
  • Home Side Box
  • E1 Multiplexer
  • Cable modem
  • ATM Switches
  • Multiplexers
  • BITS Timing
  • Digital access cross connects
  • Interfaces to SONET STS-1 Networks

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