DS26334GA2+
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA, CSBGA |
| Supplier Device Package | 256-CSBGA (17x17) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 16 |
| Current - Supply | 500mA |
| RoHS Status | Non-RoHS Compliant |
DS26334GA2+ Overview
A 256-LBGA, CSBGA package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.Telecommunications equipment is mounted with type Surface Mount.A 16 circuit is the heart of this telecom IC .When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Operating temperatures of 0°C~70°C can ensure reliable performance.Telecom equipment operates wit h a supply current of 500mA.
DS26334GA2+ Features
Available in the 256-LBGA, CSBGA package
DS26334GA2+ Applications
There are a lot of Rochester Electronics, LLC DS26334GA2+ Telecom applications.
- Remote wireless modules
- Fiber
- LAN Routers
- Wireless local loop (WLL)
- ISDN Primary Rate Interface
- Central office
- Wireless base stations
- NIU
- Channel Banks
- T1/E1/J1 Multiplexer and Channel Banks
