Parameters |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
TIN LEAD |
Technology |
CMOS |
Voltage - Supply |
3V~3.6V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
225 |
Supply Voltage |
3.3V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Function |
Controller |
Qualification Status |
COMMERCIAL |
Interface |
Serial |
Number of Circuits |
1 |
Current - Supply |
500mA |
Telecom IC Type |
FRAMER |
Height Seated (Max) |
2.34mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
Non-RoHS Compliant |
DS3134 Overview
To save board space, the 256-BGA package is used.For packing, Tray is used.In this case, Surface Mount is the mounting type.The telecom IC is composed of 1 circuits.When 3V~3.6V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.0°C~70°C is the operating temperature that can be set for reliable performance.In telecom switching configuration, 256 terminations are present.There is a voltage supply called 3.3V that it uses.As a telecom IC, FRAMER is used.The current supply is 500mA.
DS3134 Features
Available in the 256-BGA package
FRAMER as telecom IC type
DS3134 Applications
There are a lot of Rochester Electronics, LLC DS3134 Telecom applications.
- Stations
- T3 channelized access concentrators
- Voice over IP/DSL
- SDH/SONET multiplexers
- Multi-Line E1 Interface Cards
- High-Density T1/E1/J1 interfaces for Multiplexers
- Digital subscriber line access multiplexer (DSLAM)
- Wireless local loop (WLL)
- T2 Rates PCM Line Interface
- Set-Top Box