Parameters |
Mounting Type |
Surface Mount |
Package / Case |
349-BGA Exposed Pad |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
349 |
Terminal Finish |
TIN LEAD |
Voltage - Supply |
3.135V~3.465V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
240 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
349 |
JESD-30 Code |
S-PBGA-B349 |
Qualification Status |
COMMERCIAL |
Interface |
LIU |
Current - Supply |
960mA |
Telecom IC Type |
FRAMER |
Height Seated (Max) |
2.35mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
Non-RoHS Compliant |
DS31412 Overview
A 349-BGA Exposed Pad package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.Surface Mount is used as telecommunications equipment mounting type.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.Operating temperatures of -40°C~85°C can ensure reliable performance.As part of its configuration, it includes 349 terminations.With 3.3V as the supply voltage, it operates.It uses the FRAMER IC type for its telecom IC.A current of 960mA is used as the supply current.Telecommunications device is configured wit h 1 functions when designing.349 telecom product pins are designed for its configuration.
DS31412 Features
Available in the 349-BGA Exposed Pad package
FRAMER as telecom IC type
DS31412 Applications
There are a lot of Rochester Electronics, LLC DS31412 Telecom applications.
- ISDN NT1/TA
- Channel Banks
- ISDN Primary Rate Interfaces (PRA)
- ATM equipment with integrated DS1 interfaces
- Central office (CO)
- NIU
- T1/E1/J1 add/drop multiplexers (MUX)
- Cable PC
- E1 Multiplexer
- T1 Digital Cross Connects (DSX-1)