Parameters |
Mounting Type |
Surface Mount |
Package / Case |
144-BGA, CSPBGA |
Supplier Device Package |
144-TECSBGA (13x13) |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.135V~3.465V |
Function |
Line Interface Unit (LIU) |
Interface |
LIU |
Number of Circuits |
1 |
Current - Supply |
75mA |
RoHS Status |
Non-RoHS Compliant |
DS3151NB1 Overview
144-BGA, CSPBGA package is used to save board space.Packing is done according to the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.An 1-circuit makes up this telecom IC .The supply voltage of 3.135V~3.465V can increase efficiency.The operating temperature set at -40°C~85°C can offer reliable performance.Telecom equipment operates wit h a supply current of 75mA.
DS3151NB1 Features
Available in the 144-BGA, CSPBGA package
DS3151NB1 Applications
There are a lot of Rochester Electronics, LLC DS3151NB1 Telecom applications.
- ATM equipment with integrated DS1 interfaces
- DECT (Digital European Cordless Telephone) Base
- NIU
- PBX interfaces
- T1 Digital Cross Connects (DSX-1)
- CSU/DSU Equipment
- BITS Timing
- Routers
- PCM channel bank
- Cross Connects