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DS3151NB1

Telecom device1 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-DS3151NB1
  • Package: 144-BGA, CSPBGA
  • Datasheet: -
  • Stock: 175
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-BGA, CSPBGA
Supplier Device Package 144-TECSBGA (13x13)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 1
Current - Supply 75mA
RoHS Status Non-RoHS Compliant

DS3151NB1 Overview


144-BGA, CSPBGA package is used to save board space.Packing is done according to the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.An 1-circuit makes up this telecom IC .The supply voltage of 3.135V~3.465V can increase efficiency.The operating temperature set at -40°C~85°C can offer reliable performance.Telecom equipment operates wit h a supply current of 75mA.

DS3151NB1 Features


Available in the 144-BGA, CSPBGA package

DS3151NB1 Applications


There are a lot of Rochester Electronics, LLC DS3151NB1 Telecom applications.

  • ATM equipment with integrated DS1 interfaces
  • DECT (Digital European Cordless Telephone) Base
  • NIU
  • PBX interfaces
  • T1 Digital Cross Connects (DSX-1)
  • CSU/DSU Equipment
  • BITS Timing
  • Routers
  • PCM channel bank
  • Cross Connects

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