Parameters |
Mounting Type |
Surface Mount |
Package / Case |
100-LBGA, CSBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Published |
2011 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
100 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Subcategory |
Other Telecom ICs |
Voltage - Supply |
3.135V~3.465V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
3.3V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
DS3170 |
Function |
Single-Chip Transceiver |
Qualification Status |
Not Qualified |
Power Supplies |
3.3V |
Interface |
DS3, E3 |
Number of Circuits |
1 |
Current - Supply |
120mA |
Telecom IC Type |
FRAMER |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
DS3170N+ Overview
In order to save space on the board, the 100-LBGA, CSBGA package is used.To pack telecommunications equipment, the way of Tray is used.Surface Mount is used as telecommunications equipment mounting type.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Using -40°C~85°C as the operating temperature can result in reliable performance.Telecom switching configuration has 100 terminations.3.3V is its supply voltage.Telecom switching's base part number, DS3170, can be used to find related parts.The telecom IC type is FRAMER.The current supply is 120mA.Telecommunications device belongs to the subcategory of Other Telecom ICs.
DS3170N+ Features
Available in the 100-LBGA, CSBGA package
FRAMER as telecom IC type
DS3170N+ Applications
There are a lot of Maxim Integrated DS3170N+ Telecom applications.
- BITS Timing
- SDH Multiplexers
- SDH/SONET multiplexers
- Fiber in the loop (FITL)
- Multi-Line E1 Interface Cards
- Stations
- Interfaces to SONET STS-1 Networks
- CSU/DSU E1/T1/J1 Interface
- CSU/DSU Equipment
- Digital access cross connects