DS3172+
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 349-BBGA, CSBGA Exposed Pad |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2006 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
| Number of Terminations | 400 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Subcategory | Other Telecom ICs |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 3.3V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | DS3172 |
| JESD-30 Code | S-PBGA-B400 |
| Function | Single-Chip Transceiver |
| Qualification Status | Not Qualified |
| Power Supplies | 3.3V |
| Interface | DS3, E3 |
| Number of Circuits | 2 |
| Current - Supply | 328mA |
| Telecom IC Type | FRAMER |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
