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DS3251NA3

Telecom device1 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-DS3251NA3
  • Package: 144-BGA, CSPBGA
  • Datasheet: -
  • Stock: 417
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-BGA, CSPBGA
Supplier Device Package 144-TECSBGA (13x13)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 1
Current - Supply 80mA
RoHS Status Non-RoHS Compliant

DS3251NA3 Overview


To save board space, the 144-BGA, CSPBGA package is used.Telecommunications equipment is packed according to Tray's method.Surface Mount is used as telecommunications equipment mounting type.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Operating temperatures of -40°C~85°C can ensure reliable performance.An electric current of 80mA is supplied to telecom equipment .

DS3251NA3 Features


Available in the 144-BGA, CSPBGA package

DS3251NA3 Applications


There are a lot of Rochester Electronics, LLC DS3251NA3 Telecom applications.

  • Home Side Box
  • ISDN Primary Rate Interface
  • E1 Multiplexer
  • Interfaces to DS3
  • Fiber in the loop (FITL)
  • PDH Multiplexers
  • Integrated Multi-Service Access Platforms (IMAPs)
  • PBX interfaces
  • Fiber In The Loop (FITL)
  • Integrated Access Devices (IADs)

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