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DS3252+

Telecom device2 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-DS3252+
  • Package: 144-BGA, CSPBGA
  • Datasheet: PDF
  • Stock: 127
  • Description: Telecom device2 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-BGA, CSPBGA
Supplier Device Package 144-TECSBGA (13x13)
Operating Temperature 0°C~70°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 2
Current - Supply 150mA
RoHS Status ROHS3 Compliant

DS3252+ Overview


To save board space, the 144-BGA, CSPBGA package is used.In order to pack telecommunications equipment, Tray is used.The mounting type of this telecom circuit is Surface Mount.The telecom IC is composed of 2 circuits.When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.0°C~70°C is the operating temperature that can be set for reliable performance.Telecom equipment operates wit h a supply current of 150mA.

DS3252+ Features


Available in the 144-BGA, CSPBGA package

DS3252+ Applications


There are a lot of Rochester Electronics, LLC DS3252+ Telecom applications.

  • Dual battery supply voltage SLICs
  • Channel Banks
  • Fiber in the loop (FITL)
  • Multichannel DS1 Test Equipment
  • E1 Multiplexer
  • E2 Rates PCM Line Interface
  • SONET/SDH terminal
  • Voice over IP/DSL
  • Integrated Access Devices (IADs)
  • ISDN NT1/TA

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