Parameters |
Mounting Type |
Surface Mount |
Package / Case |
80-LQFP |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Series |
DSP56K/Symphony |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
80 |
Type |
Audio Processor |
Terminal Finish |
MATTE TIN |
Technology |
CMOS |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.25V |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
80 |
JESD-30 Code |
S-PQFP-G80 |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
1.3V |
Supply Voltage-Min (Vsup) |
1.2V |
Interface |
Host Interface, I2C, SAI, SPI |
Clock Frequency |
149.9MHz |
Boundary Scan |
YES |
Low Power Mode |
YES |
Format |
FIXED POINT |
Voltage - I/O |
3.30V |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Non-Volatile Memory |
ROM (84kB) |
Voltage - Core |
1.25V |
On Chip Data RAM |
54kB |
Clock Rate |
150MHz |
Height Seated (Max) |
1.6mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
ROHS3 Compliant |
DSPB56374AF Overview
The 80-LQFP package contains these electronic components.A packaging way of Tray is provided.In addition to meeting a wide range of requirements, it is a member of Audio Processor.It is mounted in the way of Surface Mount.By operating the device at the temperature of 0°C~70°C TA, a normal operation is ensured.This refers to the analog voltage range that can be input or output from 3.30V.There are several digital signal processors in the DSP56K/Symphony series, including this one.The use of it is terminated by 80.A voltage of 1.25V is used as the supply voltage.80 components have pins.Using 149.9MHz as its clock frequency, it operates.
DSPB56374AF Features
Supplied in the 80-LQFP package
DSPB56374AF Applications
There are a lot of Rochester Electronics, LLC DSPB56374AF DSP applications.
- Instrument modeling
- Consumer electronic gadgets
- Biomedical engineering
- Medical imaging
- Automobiles
- Electronic information engineering
- Signal processing for telecommunications
- Tomography technology
- Speech processing
- Other sensor array processing