DSSK60-02AR
| Parameters | |
|---|---|
| Qualification Status | Not Qualified |
| Number of Elements | 2 |
| Element Configuration | Common Cathode |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 2mA @ 200V |
| Voltage - Forward (Vf) (Max) @ If | 850mV @ 30A |
| Case Connection | ISOLATED |
| Forward Current | 60A |
| Operating Temperature - Junction | -55°C~175°C |
| Application | POWER |
| Forward Voltage | 850mV |
| Max Reverse Voltage (DC) | 200V |
| Average Rectified Current | 30A |
| Number of Phases | 1 |
| Peak Reverse Current | 2mA |
| Max Repetitive Reverse Voltage (Vrrm) | 200V |
| Diode Configuration | 1 Pair Common Cathode |
| Max Forward Surge Current (Ifsm) | 600A |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mount | Radial, Through Hole |
| Mounting Type | Through Hole |
| Package / Case | ISOPLUS247™ |
| Number of Pins | 247 |
| Diode Element Material | SILICON |
| Packaging | Tube |
| Published | 2005 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -55°C |
| Additional Feature | HIGH RELIABILTY, UL RECOGNIZED, LOW NOISE |
| HTS Code | 8541.10.00.80 |
| Terminal Position | SINGLE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 3 |
| JESD-30 Code | R-PSFM-T3 |
See Relate Datesheet
