EP2AGX125EF35I3N
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 1152-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria II GX |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| ECCN Code | 3A991 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 0.87V~0.93V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.9V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | EP2AGX125 |
| JESD-30 Code | S-PBGA-B1152 |
| Number of Outputs | 452 |
| Qualification Status | Not Qualified |
| Power Supplies | 0.91.2/3.31.52.5V |
| Number of I/O | 452 |
| Clock Frequency | 500MHz |
| Number of Inputs | 452 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 118143 |
| Total RAM Bits | 8315904 |
| Number of LABs/CLBs | 4964 |
| Height Seated (Max) | 2.6mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | RoHS Compliant |
EP2AGX125EF35I3N Overview
There are two packages that contain fpga chips: 1152-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 452 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 118143 logic elements/cells. Fpga chips is powered from a supply voltage of 0.9V. Field Programmable Gate Arrays family FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 0.87V~0.93V . As part of the Arria II GX series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. During the installation of this device, 452 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device has 8315904 RAM bits, which is the number of RAM bits that this device offers. If you are looking for related parts, you can use the base part number EP2AGX125 as a starting point. This FPGA is built as an array of 4964 LABs/CLBs. Power is supplied to the device by a 0.91.2/3.31.52.5V battery. Typically, fpga semiconductor uses a crystal oscillating at 500MHz .
EP2AGX125EF35I3N Features
452 I/Os
Up to 8315904 RAM bits
EP2AGX125EF35I3N Applications
There are a lot of Intel EP2AGX125EF35I3N FPGAs applications.
- Random logic
- Distributed Monetary Systems
- Electronic Warfare
- Bioinformatics
- DO-254
- Ecosystem
- Enterprise networking
- Wired Communications
- Security systems
- ASIC prototyping
