EP2AGX65DF25I3N
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 572-BGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria II GX |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 572 |
| ECCN Code | 3A991 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 0.87V~0.93V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.9V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | EP2AGX65 |
| JESD-30 Code | S-PBGA-B572 |
| Number of Outputs | 252 |
| Qualification Status | Not Qualified |
| Power Supplies | 0.91.2/3.31.52.5V |
| Number of I/O | 252 |
| Clock Frequency | 500MHz |
| Number of Inputs | 252 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 60214 |
| Total RAM Bits | 5371904 |
| Number of LABs/CLBs | 2530 |
| Height Seated (Max) | 2.2mm |
| Length | 25mm |
| Width | 25mm |
| RoHS Status | RoHS Compliant |
EP2AGX65DF25I3N Overview
A 572-BGA, FCBGA package is provided with this component. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 252 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 60214 logic elements/cells. In order for the device to operate, a supply voltage of 0.9V volts needs to be provided. FPGA parts like this belong to the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. The supply voltage of the device is 0.87V~0.93V , at which it runs. This is a type of FPGA that is part of the Arria II GX series of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. In order to make this device as versatile as possible, there are 252 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. There are a total of 572 terminations. The RAM bits that are offered by this fpga chips are 5371904. If you are looking for related parts, you can use the base part number EP2AGX65 as a starting point. 2530 LABs/CLBs are integrated into this FPGA. Powered by a 0.91.2/3.31.52.5V power supply, it can be operated by almost anyone. A crystal oscillating at 500MHz is one of the most common components of this device.
EP2AGX65DF25I3N Features
252 I/Os
Up to 5371904 RAM bits
EP2AGX65DF25I3N Applications
There are a lot of Intel EP2AGX65DF25I3N FPGAs applications.
- Ecosystem
- Automotive driver's assistance
- Aerospace and Defense
- Wired Communications
- Consumer Electronics
- Software-defined radio
- High Performance Computing
- Image processing
- Data Mining
- Scientific Instruments
