EP2S30F484C3N
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Stratix® II |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | 3A991 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.15V~1.25V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | EP2S30 |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 334 |
| Qualification Status | Not Qualified |
| Power Supplies | 1.21.5/3.33.3V |
| Number of I/O | 342 |
| Clock Frequency | 717MHz |
| Number of Inputs | 342 |
| Organization | 13552 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 33880 |
| Total RAM Bits | 1369728 |
| Number of LABs/CLBs | 1694 |
| Combinatorial Delay of a CLB-Max | 4.45 ns |
| Number of CLBs | 13552 |
| Height Seated (Max) | 3.5mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | RoHS Compliant |
EP2S30F484C3N Overview
There are two packages that contain fpga chips: 484-BBGA package and X package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. An FPGA part from the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order to operate it, it requires a voltage supply of 1.15V~1.25V . FPGAs belonging to the Stratix? II series are a type of FPGA that belong to the Stratix? II series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A device such as this one has 334 outputs built into it. There is an FPGA model contained in Tray in order to conserve space. In total, it has a total of 484 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1369728 bFpga chipss. You can find related parts by using the part number EP2S30, which is its base part number. 1694 LABs/CLBs are integrated into this FPGA. The device runs on a 1.21.5/3.33.3V battery and requires no additional power supply to operate. It usually uses a 717MHz crystal. Its architecture is based on 13552 CLBs.
EP2S30F484C3N Features
342 I/Os
Up to 1369728 RAM bits
EP2S30F484C3N Applications
There are a lot of Intel EP2S30F484C3N FPGAs applications.
- Broadcast
- Image processing
- Data Center
- Automotive
- Computer hardware emulation
- Aircraft navigation
- Digital signal processing
- ADAS
- Voice recognition
- Development Boards and Shields for Microcontrollers
