EP2S60F672C3N
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 672-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Stratix® II |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 672 |
| ECCN Code | 3A991 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.15V~1.25V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | EP2S60 |
| JESD-30 Code | S-PBGA-B672 |
| Number of Outputs | 484 |
| Qualification Status | Not Qualified |
| Power Supplies | 1.21.5/3.33.3V |
| Number of I/O | 492 |
| Clock Frequency | 717MHz |
| Number of Inputs | 492 |
| Organization | 24176 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 60440 |
| Total RAM Bits | 2544192 |
| Number of LABs/CLBs | 3022 |
| Combinatorial Delay of a CLB-Max | 4.45 ns |
| Number of CLBs | 24176 |
| Height Seated (Max) | 2.6mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | RoHS Compliant |
EP2S60F672C3N Overview
Fpga chips is supplied in the 672-BBGA, FCBGA package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. There are 492 I/Os for better data transfer. In order to construct a fundamental building block, 60440 logic elements/cells are required. It is powered from a supply voltage of 1.2V. The Field Programmable Gate Arrays family of FPGAs includes this part. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.15V~1.25V. An FPGA belonging to the Stratix? II series is referred to as an FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 484 outputs built into it. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. In total, there are a total of 672 terminations on fpga chips. Having a RAM bit size of 2544192 means that this device will offer you a lot of memory. You can find related parts by using the part number EP2S60, which is its base part number. This FPGA is built as an array of 3022 LABs/CLBs. Power is provided by a 1.21.5/3.33.3V battery that is included with the device. Usually, fpga semiconductor uses a 717MHz crystal. In its architecture, there are 24176 CLB modules.
EP2S60F672C3N Features
492 I/Os
Up to 2544192 RAM bits
EP2S60F672C3N Applications
There are a lot of Intel EP2S60F672C3N FPGAs applications.
- Data Center
- Development Boards and Shields for Microcontrollers
- Data center hardware accelerators
- Medical imaging
- Cryptography
- Medical ultrasounds
- Automotive
- Automotive driver's assistance
- OpenCL
- Software-defined radio
