EP3C25F256C8N
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Cyclone® III |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | 3A991 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.15V~1.25V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | EP3C25 |
| JESD-30 Code | R-PBGA-B256 |
| Number of Outputs | 156 |
| Qualification Status | Not Qualified |
| Number of I/O | 156 |
| Clock Frequency | 472.5MHz |
| Number of Inputs | 156 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 24624 |
| Total RAM Bits | 608256 |
| Number of LABs/CLBs | 1539 |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | RoHS Compliant |
EP3C25F256C8N Overview
There is a 256-LBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 156 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 24624 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 1.15V~1.25V . FPGAs belonging to the Cyclone? III series are a type of FPGA that belong to the Cyclone? III series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. In this device, there are 156 outputs that can be used. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is designed wFpga chipsh 256 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 608256 bFpga chipss. Its base part number EP3C25 can be used to find related parts. A total of 1539 LABs/CLBs make up this FPGA array. A crystal oscillating at 472.5MHz is one of the most common components of this device.
EP3C25F256C8N Features
156 I/Os
Up to 608256 RAM bits
EP3C25F256C8N Applications
There are a lot of Intel EP3C25F256C8N FPGAs applications.
- Aerospace and Defense
- Medical Applications
- Image processing
- Electronic Warfare
- High Performance Computing
- Industrial IoT
- Distributed Monetary Systems
- Automotive advanced driver assistance systems (ADAS)
- Video & Image Processing
- Data Mining
