Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
256-TFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Series |
MAX® II |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
ECCN Code |
3A991 |
Terminal Finish |
TIN SILVER COPPER |
Additional Feature |
IT CAN ALSO OPERATE AT 3.3V |
HTS Code |
8542.39.00.01 |
Subcategory |
Programmable Logic Devices |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
2.5V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
EPM1270 |
JESD-30 Code |
R-PBGA-B256 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
2.625V |
Power Supplies |
1.5/3.32.5/3.3V |
Supply Voltage-Min (Vsup) |
2.375V |
Programmable Type |
In System Programmable |
Number of I/O |
212 |
Propagation Delay |
10 ns |
Output Function |
MACROCELL |
Number of Macro Cells |
980 |
JTAG BST |
YES |
Voltage Supply - Internal |
2.5V 3.3V |
Delay Time tpd(1) Max |
6.2ns |
Number of Logic Elements/Blocks |
1270 |
RoHS Status |
RoHS Compliant |
EPM1270M256C5N Overview
There are 980 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).The product is contained in a 256-TFBGA package.There are 212 I/Os on the board.It is programmed that device terminations will be 256 .The terminal position of this electrical component is BOTTOM.Power is supplied by a voltage of 2.5V volts.This part is part of the family [0].Trayshould be used to package the chip.A reliable operation is ensured by the operating temperature of [0].It is mounted in the way of Surface Mount.As part of the MAX? IIseries, it is a type of FPGA.The device can also be used to find [0].The EPM1270indicates that related parts can be found.There are 1270 logic elements/blocks.In order for the device to operate, it requires 1.5/3.32.5/3.3V power supplies.Vsup reaches 2.625Vas the maximum supply voltage.It is recommended that the supply voltage (Vsup) be greater than 2.375V.
EPM1270M256C5N Features
256-TFBGA package
212 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies
EPM1270M256C5N Applications
There are a lot of Intel EPM1270M256C5N CPLDs applications.
- Synchronous or asynchronous mode
- Timing control
- I2C BUS INTERFACE
- Address decoders
- Page register
- Wide Vin Industrial low power SMPS
- SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
- ROM patching
- Wireless Infrastructure Base Band Unit and Remote Radio Unit
- Preset swapping