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EPM240F100I5

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM240 100-LBGA


  • Manufacturer: Intel
  • Nocochips NO: 386-EPM240F100I5
  • Package: 100-LBGA
  • Datasheet: PDF
  • Stock: 964
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM240 100-LBGA (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 100-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® II
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Additional Feature YES
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1mm
Base Part Number EPM240
JESD-30 Code S-PBGA-B100
Qualification Status Not Qualified
Power Supplies 1.5/3.32.5/3.3V
Programmable Type In System Programmable
Number of I/O 80
Propagation Delay 7.5 ns
Number of Macro Cells 192
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 4.7ns
Number of Logic Elements/Blocks 240
RoHS Status RoHS Compliant

EPM240F100I5 Overview


This network has 192macro cells, which are cells that provide radio coverage provided by a high-power cell site (tower, antenna, mast).The item is packaged with 100-LBGA.The device is programmed with 80 I/O ports.The device is programmed with 100 terminations.This electrical part is wired with a terminal position of BOTTOM.The part is included in Programmable Logic Devices.Trayis the packaging method.The operating temperature of the machine is -40°C~100°C TJ to ensure its reliability.Chips should be mounted by Surface Mount.In terms of FPGAs, it belongs to the MAX? II series.This device is also capable of displaying [0].EPM240contains its related parts.There are a total of 240 logic elements or blocks.A power supply of 1.5/3.32.5/3.3Vis required to operate it.

EPM240F100I5 Features


100-LBGA package
80 I/Os
The operating temperature of -40°C~100°C TJ
1.5/3.32.5/3.3V power supplies

EPM240F100I5 Applications


There are a lot of Intel EPM240F100I5 CPLDs applications.

  • Network Interface Card (NIC) and Host Bus Adapter (HBA)
  • Software Configuration of Add-In Boards
  • Protection relays
  • Portable digital devices
  • Storage Cards and Storage Racks
  • Auxiliary Power Supply Isolated and Non-isolated
  • Software-driven hardware configuration
  • ON-CHIP OSCILLATOR CIRCUIT
  • PULSE WIDTH MODULATION (PWM)
  • I2C BUS INTERFACE

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