Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
100-TFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Series |
MAX® II |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
100 |
ECCN Code |
EAR99 |
Terminal Finish |
TIN SILVER COPPER |
Additional Feature |
IT CAN ALSO OPERATE AT 3.3V |
HTS Code |
8542.39.00.01 |
Subcategory |
Programmable Logic Devices |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.8V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
EPM570 |
JESD-30 Code |
S-PBGA-B100 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.89V |
Power Supplies |
1.5/3.31.8V |
Supply Voltage-Min (Vsup) |
1.71V |
Programmable Type |
In System Programmable |
Number of I/O |
76 |
Propagation Delay |
9.5 ns |
Output Function |
MACROCELL |
Number of Macro Cells |
440 |
JTAG BST |
YES |
Voltage Supply - Internal |
1.71V~1.89V |
Delay Time tpd(1) Max |
9ns |
Number of Logic Elements/Blocks |
570 |
RoHS Status |
RoHS Compliant |
EPM570ZM100C6N Overview
A mobile phone network consists of 440macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).There is a 100-TFBGA package containing it.There are 76 I/Os programmed in it.The termination of a device is set to [0].There is a BOTTOMterminal position on the electrical part in question.A voltage of 1.8V is used as the power supply for this device.It is a part of the family [0].Trayshould be used for packaging the chip.The temperature at which it operates is set to 0°C~85°C TJin order to ensure its reliability.Ideally, the chip should be mounted by Surface Mount.FPGAs belonging to the MAX? IIseries contain this type of chip.It is also characterized by IT CAN ALSO OPERATE AT 3.3V.According to the EPM570, its related parts can be found.A total of 570logic elements/blocks are present.The system runs on a power supply of 1.5/3.31.8V watts.In this case, the maximum supply voltage (Vsup) reaches 1.89V.The supply voltage (Vsup) should be greater than 1.71V.
EPM570ZM100C6N Features
100-TFBGA package
76 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies
EPM570ZM100C6N Applications
There are a lot of Intel EPM570ZM100C6N CPLDs applications.
- Voltage level translation
- I/O PORTS (MCU MODULE)
- Power automation
- Random logic replacement
- ON-CHIP OSCILLATOR CIRCUIT
- D/T registers and latches
- I2C BUS INTERFACE
- ROM patching
- Power up sequencing
- Address decoders