EPM570ZM256I8N
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-TFBGA |
| Supplier Device Package | 256-MBGA (11x11) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | MAX® II |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | EPM570 |
| Programmable Type | In System Programmable |
| Number of I/O | 160 |
| Number of Macro Cells | 440 |
| Voltage Supply - Internal | 1.71V~1.89V |
| Delay Time tpd(1) Max | 9ns |
| Number of Logic Elements/Blocks | 570 |
| RoHS Status | RoHS Compliant |
EPM570ZM256I8N Overview
A mobile phone network consists of 440macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).The product is contained in a 256-TFBGA package.The device is programmed with 160 I/Os.Trayis the packaging method.A reliable operation is ensured by the operating temperature of [0].It is recommended that the chip be mounted by Surface Mount.As part of the MAX? IIseries, it is a type of FPGA.The EPM570can be used to identify its related parts.There are 570 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.
EPM570ZM256I8N Features
256-TFBGA package
160 I/Os
The operating temperature of -40°C~100°C TJ
EPM570ZM256I8N Applications
There are a lot of Intel EPM570ZM256I8N CPLDs applications.
- Custom state machines
- Wide Vin Industrial low power SMPS
- Voltage level translation
- ON-CHIP OSCILLATOR CIRCUIT
- TIMERS/COUNTERS
- DDC INTERFACE
- Digital multiplexers
- Digital designs
- PLC analog input modules
- I2C BUS INTERFACE
