Parameters |
Mounting Type |
Surface Mount |
Package / Case |
208-BFQFP Exposed Pad |
Supplier Device Package |
208-RQFP (28x28) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Series |
MAX® 7000S |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Programmable Type |
In System Programmable |
Number of I/O |
164 |
Number of Gates |
5000 |
Number of Macro Cells |
256 |
Voltage Supply - Internal |
4.75V~5.25V |
Delay Time tpd(1) Max |
7.5ns |
Number of Logic Elements/Blocks |
16 |
EPM7256SRC208-7ES Overview
In the mobile phone network, there are 256macro cells, which are cells with high-power antennas and towers.It is embedded in the 208-BFQFP Exposed Pad package.There are 164 I/Os programmed in it.It is packaged in the way of Tray.To ensure reliability, the device operates at a temperature of [0].Ensure that the chip is mounted by Surface Mount.The MAX? 7000Sseries comprises this type of FPGA.There are 5000 gates, which are devices that acts as a building block for digital circuits. This logic block consists of 16logic elements.
EPM7256SRC208-7ES Features
208-BFQFP Exposed Pad package
164 I/Os
The operating temperature of 0°C~70°C TA
EPM7256SRC208-7ES Applications
There are a lot of Intel EPM7256SRC208-7ES CPLDs applications.
- STANDARD SERIAL INTERFACE UART
- Timing control
- Configurable Addressing of I/O Boards
- Voltage level translation
- Wide Vin Industrial low power SMPS
- Address decoders
- Preset swapping
- Power automation
- Boolean function generators
- Bootloaders for FPGAs