Parameters |
Mounting Type |
Surface Mount |
Package / Case |
304-BFQFP |
Supplier Device Package |
304-RQFP (40x40) |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tray |
Series |
MAX® 9000 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
EPM9560 |
Programmable Type |
In System Programmable |
Number of I/O |
216 |
Number of Gates |
12000 |
Number of Macro Cells |
560 |
Voltage Supply - Internal |
4.5V~5.5V |
Delay Time tpd(1) Max |
20ns |
Number of Logic Elements/Blocks |
35 |
EPM9560RI304-20 Overview
560macrocells exist, which are cells in a mobile phone network that are primarily composed of high-power towers, antennas, or masts.There is a 304-BFQFP package containing it.It is programmed with 216 I/Os.Trayis the packaging method.It operates with the operating temperature of -40°C~85°C TA to ensure its reliability.The chip should be mounted by Surface Mount.FPGAs belonging to the MAX? 9000series contain this type of chip.According to the EPM9560, its related parts can be found.As a building block for digital circuits, there are 12000gates.There are 35 logic elements or blocks present.
EPM9560RI304-20 Features
304-BFQFP package
216 I/Os
The operating temperature of -40°C~85°C TA
EPM9560RI304-20 Applications
There are a lot of Intel EPM9560RI304-20 CPLDs applications.
- POWER-SAVING MODES
- Voltage level translation
- SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
- USB Bus
- ToR/Aggregation/Core Switch and Router
- Configurable Addressing of I/O Boards
- I/O expansion
- White goods (Washing, Cold, Aircon ,...)
- ROM patching
- Wide Vin Industrial low power SMPS