ES2DA-13-F
| Parameters | |
|---|---|
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | ES2D |
| Pin Count | 2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 5μA @ 200V |
| Output Current | 2A |
| Voltage - Forward (Vf) (Max) @ If | 920mV @ 2A |
| Forward Current | 2A |
| Operating Temperature - Junction | -55°C~150°C |
| Max Surge Current | 50A |
| Application | EFFICIENCY |
| Forward Voltage | 920mV |
| Max Reverse Voltage (DC) | 200V |
| Average Rectified Current | 2A |
| Number of Phases | 1 |
| Reverse Recovery Time | 25 ns |
| Peak Reverse Current | 5μA |
| Max Repetitive Reverse Voltage (Vrrm) | 200V |
| Capacitance @ Vr, F | 25pF @ 4V 1MHz |
| Peak Non-Repetitive Surge Current | 50A |
| Reverse Voltage | 200V |
| Max Forward Surge Current (Ifsm) | 50A |
| Recovery Time | 25 ns |
| Max Junction Temperature (Tj) | 150°C |
| Reverse Voltage (DC) | 200V |
| Natural Thermal Resistance | 20 °C/W |
| Height | 2.4mm |
| Length | 4.6mm |
| Width | 2.92mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | DO-214AC, SMA |
| Number of Pins | 2 |
| Weight | 64.013223mg |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2010 |
| JESD-609 Code | e3 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Capacitance | 25pF |
| Subcategory | Rectifier Diodes |
| Voltage - Rated DC | 200V |
| Terminal Position | DUAL |
| Terminal Form | C BEND |
| Peak Reflow Temperature (Cel) | 260 |
| Current Rating | 2A |
See Relate Datesheet
