ESD-136-T-05
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Contact Shape | Circular |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2014 |
| Series | ESD |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Connector Type | Elevated Socket |
| Number of Positions | 72 |
| Number of Rows | 2 |
| Gender | Receptacle |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Contact Type | Female Socket |
| Pitch | 2.54mm |
| Insulation Height | 0.500 12.70mm |
| Style | Board to Board |
| Number of Positions Loaded | All |
| Pitch - Mating | 0.100 2.54mm |
| Insulation Color | Black |
| Row Spacing - Mating | 0.100 (2.54mm) |
| Contact Length - Post | 0.165 4.19mm |
| Number of Contacts | 72 |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10.0μin 0.25μm |
| Material Flammability Rating | UL94 V-0 |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
