Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOT-23-6 Thin, TSOT-23-6 |
Number of Pins | 6 |
Weight | 36mg |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1999 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Subcategory | Peripheral Drivers |
Power Rating | 700mW |
Voltage - Rated DC | 20V |
Max Power Dissipation | 700mW |
Technology | NMOS |
Terminal Form | GULL WING |
Number of Functions | 1 |
Terminal Pitch | 0.95mm |
Current Rating | 1.5A |
Base Part Number | FDC6324 |
Number of Outputs | 1 |
Output Type | P-Channel |
Max Output Current | 1.5A |
Operating Supply Voltage | 20V |
Voltage | 20V |
Interface | On/Off |
Element Configuration | Dual |
Current | 1A |
Output Configuration | High Side |
Power Dissipation | 700mW |
Output Current | 1A |
Voltage - Supply (Vcc/Vdd) | 1.5V~8V |
Input Type | Non-Inverting |
Switch Type | General Purpose |
Drain to Source Voltage (Vdss) | 8V |
Nominal Input Voltage | 20V |
Continuous Drain Current (ID) | 1.5A |
Ratio - Input:Output | 1:1 |
Voltage - Load | 3V~20V |
Driver Number of Bits | 1 |
Max Duty Cycle | 2 % |
Output Peak Current Limit-Nom | 1A |
Max Junction Temperature (Tj) | 150°C |
Built-in Protections | TRANSIENT |
Height | 900μm |
Length | 3mm |
Width | 1.7mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
ON Semiconductor's patented high-cell-density DMOS technology is used to make the FDC6324L. This extremely high-density technique is specifically designed to reduce on-state resistance and improve switching performance. These devices are well-suited for low-voltage, high-side-load switch applications that need low conduction loss and ease of driving.
For exceptionally low on-resistance, a high-density cell design is used.
VON/OFF >6KV Human Body Model with Zener Protection for ESD Ruggedness.
For enhanced thermal and electrical capabilities, the SuperSOTTM-6 package design uses a copper lead frame.
Switching applications