FMN-3306S
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | TO-3PF Variant, 2 Leads |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 2013 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.80 |
| Terminal Position | SINGLE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PSFM-T2 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 200μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If | 1.3V @ 30A |
| Case Connection | ISOLATED |
| Operating Temperature - Junction | -40°C~150°C |
| Voltage - DC Reverse (Vr) (Max) | 600V |
| Max Reverse Voltage (DC) | 600V |
| Average Rectified Current | 30A |
| Number of Phases | 1 |
| Reverse Recovery Time | 150 ns |
| Non-rep Pk Forward Current-Max | 150A |
| Reverse Current-Max | 200μA |
| Natural Thermal Resistance | 2 °C/W |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
