Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 20-PowerDIP Module (1.220, 31.00mm) |
Weight | 5.70216g |
Published | 2015 |
Series | Motion SPM® 55 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 20 |
ECCN Code | EAR99 |
Type | IGBT |
Terminal Finish | Tin (Sn) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Additional Feature | ALSO REQUIRED HIGH SIDE BIAS VOLT OF 13V TO 18.5V |
HTS Code | 8541.29.00.95 |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Supply Voltage | 15V |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XDMA-T20 |
Voltage - Isolation | 1500Vrms |
Supply Voltage-Max (Vsup) | 16.5V |
Supply Voltage-Min (Vsup) | 14V |
Configuration | 3 Phase Inverter |
Max Current Rating | 5A |
Output Current-Max | 10A |
Collector Emitter Voltage (VCEO) | 2.25V |
Min Breakdown Voltage | 600V |
Height Seated (Max) | 6mm |
Length | 37mm |
Width | 21mm |
RoHS Status | ROHS3 Compliant |