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FNB50560TD1

MODULE SPM 600V 5A SPM55


  • Manufacturer: ON Semiconductor
  • Nocochips NO: 598-FNB50560TD1
  • Package: 20-PowerDIP Module (1.220, 31.00mm)
  • Datasheet: PDF
  • Stock: 852
  • Description: MODULE SPM 600V 5A SPM55 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Mount Through Hole
Mounting Type Through Hole
Package / Case 20-PowerDIP Module (1.220, 31.00mm)
Weight 5.70216g
Published 2015
Series Motion SPM® 55
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
Additional Feature ALSO REQUIRED HIGH SIDE BIAS VOLT OF 13V TO 18.5V
HTS Code 8541.29.00.95
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 15V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XDMA-T20
Voltage - Isolation 1500Vrms
Supply Voltage-Max (Vsup) 16.5V
Supply Voltage-Min (Vsup) 14V
Configuration 3 Phase Inverter
Max Current Rating 5A
Output Current-Max 10A
Collector Emitter Voltage (VCEO) 2.25V
Min Breakdown Voltage 600V
Height Seated (Max) 6mm
Length 37mm
Width 21mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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