Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 25-PowerDIP Module (0.815, 20.70mm) |
Weight | 3.794g |
Published | 2016 |
Series | Motion SPM® 8 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 25 |
ECCN Code | EAR99 |
Type | IGBT |
Terminal Finish | Tin (Sn) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
HTS Code | 8541.29.00.95 |
Technology | HYBRID |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Supply Voltage | 300V |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XDFM-T25 |
Voltage - Isolation | 1500Vrms |
Supply Voltage-Max (Vsup) | 400V |
Temperature Grade | AUTOMOTIVE |
Configuration | 3 Phase |
Max Current Rating | 10A |
Output Current-Max | 20A |
Collector Emitter Voltage (VCEO) | 2.1V |
Min Breakdown Voltage | 600V |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |