FQA11N90-F109
| Parameters | |
|---|---|
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| Subcategory | FET General Purpose Power |
| Technology | MOSFET (Metal Oxide) |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Power Dissipation-Max | 300W Tc |
| Element Configuration | Single |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 300W |
| Turn On Delay Time | 65 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 960m Ω @ 5.7A, 10V |
| Vgs(th) (Max) @ Id | 5V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 3500pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 11.4A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 94nC @ 10V |
| Rise Time | 135ns |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Vgs (Max) | ±30V |
| Fall Time (Typ) | 90 ns |
| Turn-Off Delay Time | 165 ns |
| Continuous Drain Current (ID) | 11.4A |
| Gate to Source Voltage (Vgs) | 30V |
| Drain-source On Resistance-Max | 0.96Ohm |
| Drain to Source Breakdown Voltage | 900V |
| Pulsed Drain Current-Max (IDM) | 45.6A |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 16 hours ago) |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | TO-3P-3, SC-65-3 |
| Number of Pins | 3 |
| Weight | 6.401g |
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tube |
| Series | QFET® |
| Pbfree Code | yes |
| Part Status | Active |
See Relate Datesheet
