FQA160N08
| Parameters | |
|---|---|
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Current Rating | 160A |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Power Dissipation-Max | 375W Tc |
| Element Configuration | Single |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 375W |
| Turn On Delay Time | 85 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 7m Ω @ 80A, 10V |
| Vgs(th) (Max) @ Id | 4V @ 250μA |
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 6 days ago) |
| Input Capacitance (Ciss) (Max) @ Vds | 7900pF @ 25V |
| Mount | Through Hole |
| Current - Continuous Drain (Id) @ 25°C | 160A Tc |
| Mounting Type | Through Hole |
| Gate Charge (Qg) (Max) @ Vgs | 290nC @ 10V |
| Package / Case | TO-3P-3, SC-65-3 |
| Rise Time | 970ns |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Number of Pins | 3 |
| Vgs (Max) | ±25V |
| Weight | 6.401g |
| Fall Time (Typ) | 410 ns |
| Transistor Element Material | SILICON |
| Turn-Off Delay Time | 260 ns |
| Operating Temperature | -55°C~175°C TJ |
| Continuous Drain Current (ID) | 160A |
| Gate to Source Voltage (Vgs) | 25V |
| Packaging | Tube |
| Drain-source On Resistance-Max | 0.007Ohm |
| Published | 2000 |
| Drain to Source Breakdown Voltage | 80V |
| Pulsed Drain Current-Max (IDM) | 640A |
| Series | QFET® |
| JESD-609 Code | e3 |
| Height | 18.9mm |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Length | 15.8mm |
| Number of Terminations | 3 |
| Width | 5mm |
| ECCN Code | EAR99 |
| Terminal Finish | Tin (Sn) |
| RoHS Status | ROHS3 Compliant |
| Subcategory | FET General Purpose Power |
| Lead Free | Lead Free |
| Voltage - Rated DC | 80V |
| Technology | MOSFET (Metal Oxide) |
See Relate Datesheet
