FSB50550AB
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 23-PowerDIP Module (0.644, 16.35mm) |
| Weight | 0g |
| Published | 2017 |
| Series | Motion-SPM® |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 21 |
| Type | MOSFET |
| Terminal Finish | Tin (Sn) |
| Technology | HYBRID |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 300V |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XDMA-T21 |
| Voltage - Isolation | 1500Vrms |
| Configuration | 3 Phase |
| Voltage | 500V |
| Current | 2A |
| Height Seated (Max) | 3.3mm |
| Length | 29mm |
| Width | 12mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
