Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 5 months ago) |
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | TO-249AB |
Diode Element Material | SILICON |
Packaging | Bulk |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | SINGLE |
Terminal Form | SOLDER LUG |
JESD-30 Code | R-PSFM-D3 |
Operating Temperature (Max) | 150°C |
Number of Elements | 2 |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 1mA @ 200V |
Voltage - Forward (Vf) (Max) @ If | 920mV @ 80A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -55°C~150°C |
Application | POWER |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 80A |
Number of Phases | 1 |
Non-rep Pk Forward Current-Max | 1000A |
Diode Configuration | 1 Pair Common Cathode |
Reverse Current-Max | 1000μA |
RoHS Status | RoHS Compliant |