FSV10150V
| Parameters | |
|---|---|
| Terminal Finish | Tin (Sn) |
| HTS Code | 8541.10.00.80 |
| Terminal Position | DUAL |
| Terminal Form | FLAT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PDSO-F3 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 20μA @ 150V |
| Voltage - Forward (Vf) (Max) @ If | 840mV @ 10A |
| Case Connection | CATHODE |
| Forward Current | 10A |
| Operating Temperature - Junction | -55°C~150°C |
| Application | GENERAL PURPOSE |
| Max Reverse Voltage (DC) | 150V |
| Average Rectified Current | 10A |
| Number of Phases | 1 |
| Max Repetitive Reverse Voltage (Vrrm) | 150V |
| Reverse Current-Max | 20μA |
| Max Forward Surge Current (Ifsm) | 180A |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 4 days ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | TO-277, 3-PowerDFN |
| Weight | 113.6mg |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2016 |
| Series | Automotive, AEC-Q101 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| ECCN Code | EAR99 |
See Relate Datesheet
