Parameters | |
---|---|
Packaging | Tray |
Series | GC5318 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 388 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
HTS Code | 8542.39.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.5V |
Terminal Pitch | 1mm |
Function | Upconverter |
Operating Supply Voltage | 3.6V |
Temperature Grade | INDUSTRIAL |
Telecom IC Type | BASEBAND CIRCUIT |
RF Type | Cellular, CDMA2000, UMTS |
Height Seated (Max) | 2.5mm |
Length | 27mm |
Width | 27mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Mounting Type | Surface Mount |
Package / Case | 388-BBGA Exposed Pad |
Surface Mount | YES |
Number of Pins | 388 |