Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 484-BBGA Exposed Pad |
Surface Mount | YES |
Number of Pins | 484 |
Packaging | Bulk |
JESD-609 Code | e1 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 484 |
ECCN Code | 3A001.A.3 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
HTS Code | 8542.31.00.01 |
Subcategory | Microprocessors |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.1V |
Terminal Pitch | 1mm |
Base Part Number | GC6016 |
Function | Digital Signal Processor |
Supply Voltage-Max (Vsup) | 1.15V |
Power Supplies | 1.21.83.3V |
Supply Voltage-Min (Vsup) | 1.05V |
Clock Frequency | 310MHz |
Address Bus Width | 8 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 16 |
Format | FLOATING POINT |
RF Type | LTE, TDS-CDMA, W-CDMA |
Secondary Attributes | Up/Down Converter |
Barrel Shifter | NO |
Internal Bus Architecture | MULTIPLE |
Height Seated (Max) | 2.48mm |
Length | 23mm |
Width | 23mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |