GS1K-TP
| Parameters | |
|---|---|
| Base Part Number | GS1K |
| Pin Count | 2 |
| JESD-30 Code | R-PDSO-C2 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Speed | Standard Recovery >500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 10μA @ 800V |
| Voltage - Forward (Vf) (Max) @ If | 1.1V @ 1A |
| Operating Temperature - Junction | -55°C~150°C |
| Output Current-Max | 1A |
| Voltage - DC Reverse (Vr) (Max) | 800V |
| Current - Average Rectified (Io) | 1A |
| Rep Pk Reverse Voltage-Max | 800V |
| Capacitance @ Vr, F | 15pF @ 4V 1MHz |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | DO-214AC, SMA |
| Surface Mount | YES |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2008 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8541.10.00.80 |
| Terminal Position | DUAL |
| Terminal Form | C BEND |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 10 |
See Relate Datesheet
