Parameters |
Mounting Type |
Surface Mount |
Package / Case |
56-TFSOP (0.240, 6.10mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tube |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Number of Terminations |
56 |
Terminal Finish |
MATTE TIN |
Additional Feature |
TTL TO GTLP SIGNAL LEVEL TRANSLATOR |
Technology |
CMOS |
Voltage - Supply |
3.15V~3.45V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Terminal Pitch |
0.5mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
56 |
JESD-30 Code |
R-PDSO-G56 |
Qualification Status |
COMMERCIAL |
Output Type |
3-State |
Number of Elements |
1 |
Supply Voltage-Max (Vsup) |
3.45V |
Number of Ports |
2 |
Family |
GTL |
Current - Output High, Low |
32mA 32mA |
Logic Type |
Transceiver, Non-Inverting |
Output Polarity |
TRUE |
Number of Bits per Element |
17 |
Propagation Delay (tpd) |
8.7 ns |
RoHS Status |
ROHS3 Compliant |
GTLP16617MTD Overview
Logical driver uses a neat 56-TFSOP (0.240, 6.10mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Transceiver, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 3.15V~3.45V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 32mA 32mA. Logical driver can deal with 3-State output (s). All of the 1 elements are put into use. 56 terminations with different functions. GTL family part. 56 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 17 bits for each element. Logical driver features TTL TO GTLP SIGNAL LEVEL TRANSLATOR to better serve the need.
GTLP16617MTD Features
TTL TO GTLP SIGNAL LEVEL TRANSLATOR
GTLP16617MTD Applications
There are a lot of Rochester Electronics, LLC GTLP16617MTD Buffers & Transceivers applications.
- Automation systems
- AV receiver
- Telecom and datacom networking applications
- Wireless transmission
- Wireless 3D game
- Laser diode bonding
- High-speed computer links
- Changeing the frequency from IF to RF
- Clock radio
- Wireless modems