Parameters |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
Terminal Finish |
MATTE TIN |
Technology |
BICMOS |
Voltage - Supply |
3.15V~3.45V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
8 |
JESD-30 Code |
R-PDSO-G8 |
Qualification Status |
COMMERCIAL |
Output Type |
3-State |
Number of Elements |
1 |
Supply Voltage-Max (Vsup) |
3.45V |
Number of Ports |
2 |
Number of Bits |
1 |
Family |
GTLP |
Current - Output High, Low |
24mA 24mA |
Logic Type |
Transceiver, Non-Inverting |
Output Polarity |
TRUE |
Propagation Delay (tpd) |
7.3 ns |
Height Seated (Max) |
0.9mm |
Length |
2.3mm |
Width |
2mm |
RoHS Status |
ROHS3 Compliant |
Mounting Type |
Surface Mount |
Package / Case |
8-VFSOP (0.091, 2.30mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tape & Reel (TR) |
JESD-609 Code |
e3 |
GTLP1B151K8X Overview
Logical driver uses a neat 8-VFSOP (0.091, 2.30mm Width) package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Transceiver, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 3.15V~3.45V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 24mA 24mA. Logical driver can deal with 3-State output (s). All of the 1 elements are put into use. 8 terminations with different functions. Buffer IC reuqires a supply voltage of 3.3V. This buffer driver is part of the GTLP family of parts. 8 pins are set with the electric part. Enhanced with 2 ports. 1 bits are included within the electrical component.
GTLP1B151K8X Features
GTLP1B151K8X Applications
There are a lot of Rochester Electronics, LLC GTLP1B151K8X Buffers & Transceivers applications.
- 1x/2x Fiber Channel
- Wireless 3D game
- Satellite ground stations
- Indoor ad hoc meeting
- Ethernet circuitry
- Wireless network systems
- Structural bonding
- Changeing the frequency from IF to RF
- Wireless access points
- AV receiver