HC5513BIM
| Parameters | |
|---|---|
| Mount | Through Hole |
| Package / Case | DIP |
| Published | 2000 |
| JESD-609 Code | e0 |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 28 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Subcategory | Analog Transmission Interfaces |
| Technology | BIPOLAR |
| Terminal Position | QUAD |
| Terminal Form | J BEND |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PQCC-J28 |
| Qualification Status | Not Qualified |
| Power Supplies | +-5V |
| Temperature Grade | INDUSTRIAL |
| Number of Circuits | 1 |
| Power Dissipation-Max | 1.5W |
| Operating Supply Current | 2.25mA |
| Telecom IC Type | SLIC |
| Neg Supply Voltage-Nom | -5V |
| Battery Feed | CONSTANT CURRENT |
| Hybrid | 2-4 CONVERSION |
| Battery Supply | -28 V |
| Height Seated (Max) | 4.57mm |
| RoHS Status | RoHS Compliant |
HC5513BIM Overview
A DIP package saves space on a board.A 1-circuit composes this telecom IC .Through Hole is mounted on telecom switching.In telecom switching configuration, there are 28 terminations.It requires a supply voltage of 5V.Telecom ICs are of type SLIC.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 2.25mA.In the Analog Transmission Interfaces subcategory, telecommunications device belongs.A minimum temperature value -40°C is set to ensure normal operation.It is necessary to set the temperature at the maximum value of 85°C for the telecom IC to function normally.Telecommunications device is configured wit h 1 functions when designing.
HC5513BIM Features
Available in the DIP package
SLIC as telecom IC type
Operating supply current of 2.25mA
HC5513BIM Applications
There are a lot of Intersil (Renesas Electronics America) HC5513BIM Telecom applications.
- E1 Rates PCM Line Interface
- ISDN Primary Rate Interface
- Integrated Multi-Service Access Platforms (IMAPs)
- CSU/DSU E1 Interface
- PCM Test Equipment
- SDH/SONET multiplexers
- ATM equipment with integrated DS1 interfaces
- Short/Medium Loop
- Switches
- Channel Banks
