HC55185ECRZ
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 32-VQFN Exposed Pad |
| Supplier Device Package | 32-QFN (7x7) |
| Operating Temperature | 0°C~75°C |
| Packaging | Tray |
| Published | 2001 |
| Series | RSLIC18 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Subscriber Line Interface Concept (SLIC) |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
HC55185ECRZ Overview
The 32-VQFN Exposed Pad package reduces the amount of space on a board.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.1 circuits make up this telecom IC .The operating temperature set at 0°C~75°C can offer reliable performance.The RSLIC18 series is capable of providing a number of similar functions to the W series.
HC55185ECRZ Features
Available in the 32-VQFN Exposed Pad package
HC55185ECRZ Applications
There are a lot of Rochester Electronics, LLC HC55185ECRZ Telecom applications.
- DECT (Digital European Cordless Telephone) Base Stations
- Network Multiplexing and Terminating Equipment
- LAN Routers
- SONET/SDH terminal
- Interfaces to SONET STS-1 Networks
- Fractional T1/E1/J1
- Codec function on telephone switch line cards
- Switching Systems
- Fiber Optic Terminals
- E2 Rates PCM Line Interface
