HC55185FCR
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 32-VQFN Exposed Pad |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C |
| Packaging | Tray |
| Series | RSLIC18 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 32 |
| Technology | BIPOLAR |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 240 |
| Supply Voltage | 5V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PQCC-N32 |
| Function | Subscriber Line Interface Concept (SLIC) |
| Qualification Status | Not Qualified |
| Number of Circuits | 1 |
| Length | 7mm |
| Width | 7mm |
| RoHS Status | Non-RoHS Compliant |
HC55185FCR Overview
Space is saved on the board by using the 32-VQFN Exposed Pad package.For packing, Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.A 1-circuit composes this telecom IC .Using 0°C~85°C as the operating temperature can result in reliable performance.Configuration of this telecom circuit has 32 terminations.It operates at voltage 5V.This part can perform many functions similar to the electronic parts under the RSLIC18 series.
HC55185FCR Features
Available in the 32-VQFN Exposed Pad package
HC55185FCR Applications
There are a lot of Rochester Electronics, LLC HC55185FCR Telecom applications.
- SONET/SDH terminal
- Channel Banks
- NIU
- E1 Multiplexer
- T3 channelized access concentrators
- Digital Cross-connect Systems (DCS)
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- PCM channel bank
- Public switching systems
- Fractional T1/E1/J1
