Parameters | |
---|---|
Lifecycle Status | NRND (Last Updated: 1 week ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-WFBGA, DSBGA |
Number of Pins | 8 |
Operating Temperature | -20°C~85°C |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Voltage - Supply | 3V~5V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 3V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | HDC1008 |
Output | 14b |
Output Type | I2C |
Operating Supply Voltage | 5.5V |
Supply Voltage-Max (Vsup) | 5V |
Supply Voltage-Min (Vsup) | 2.7V |
Analog IC - Other Type | ANALOG CIRCUIT |
Accuracy | ±4% RH |
Response Time | 15s |
Sensor Type | Humidity, Temperature |
Humidity Range | 0 ~ 100% RH |
Height | 675μm |
Length | 0m |
Width | 0m |
Thickness | 360μm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |