HEF4007UBP,652
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 14-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Published | 1998 |
| Series | 4000B |
| JESD-609 Code | e4 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 14 |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Technology | CMOS |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 3 |
| Supply Voltage | 3V~18V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | 4007 |
| Pin Count | 14 |
| JESD-30 Code | R-PDIP-T14 |
| Qualification Status | Not Qualified |
| Load Capacitance | 50pF |
| Number of Bits | 3 |
| Family | 4000/14000/40000 |
| Number of Inputs | 1 |
| Logic Type | Complementary Pair Plus Inverter |
| Propagation Delay (tpd) | 80 ns |
| Height Seated (Max) | 4.2mm |
| Length | 19.025mm |
| Width | 7.62mm |
| RoHS Status | ROHS3 Compliant |
HEF4007UBP,652 Overview
It is used to package items using Tube.It is included in package 14-DIP (0.300, 7.62mm).The voltage of 3V~18V is supplied to make sure that the device is able to operate normally.The Through Hole method of mounting electronic parts on a PCB is one of the most common methods.In terms of its operating temperature, it is set at -55°C~125°C.Information is stored in the memory with a size of 3 bits.There are several similarities among the electronic parts in the 4000B series.Parts related to the base part number 4007 can be found.14 is the sum of all component pins.Through 14 terminations, signals are prevented from reflecting off the end of transmission lines.Optimised for high quality and reliability, this electronic component belongs to the family of 4000/14000/40000.As a basis for its configuration, it is equipped with 1 inputs.
HEF4007UBP,652 Features
HEF4007UBP,652 Applications
There are a lot of NXP USA Inc. HEF4007UBP,652 Specialty Logic ICs applications.
- Cable network front end
- Wireless multimedia center in smart home
- High-speed computer links
- Wireless modems
- IP cameras
- Satellite communications networks
- AV receiver
- Broadcast application
- Changeing the frequency from IF to RF
- Laser diode bonding
